Ultra-Miniature 0.003 mm2 PNP-Based Thermal Sensor for CPU Thermal Monitoring

Ori Bass; Joseph Shor

doi:10.1109/ESSCIRC.2018.8494268

Ultra-Miniature 0.003 mm² PNP-Based Thermal Sensor for CPU Thermal Monitoring

Ori Bass, Joseph Shor

Bar-Ilan University - The Alexander Kofkin Faculty of Engineering

Bar-Ilan University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Miniaturized, integrated thermal sensors are utilized to measure hot and cold spots in CPU's in multiple locations and are critical for the power/performance of the chip. In this paper we report an ultra-miniature, 0.003 mm², PNP thermal sensor in TSMC 65nm. The sensor utilizes a novel switched-capacitor bandgap reference and a single bit sigma-delta modulator to achieve a maximum error of ±1.35°C and a resolution of 130mK for a 12 bit, 4ms conversion. The sensor is the smallest reported BJT bandgap-based sensor, especially when considering the process node, and one of the smallest in all mechanisms. It has a competitive accuracy and resolution compared to compact bandgap-based sensors which can meet the CPU area specifications (< 0.02 mm²).

Original language	English
Title of host publication	ESSCIRC 2018 - IEEE 44th European Solid State Circuits Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	110-113
Number of pages	4
ISBN (Electronic)	9781538654040
DOIs	https://doi.org/10.1109/ESSCIRC.2018.8494268
State	Published - 16 Oct 2018
Event	44th IEEE European Solid State Circuits Conference, ESSCIRC 2018 - Dresden, Germany Duration: 3 Sep 2018 → 6 Sep 2018

Publication series

Name	ESSCIRC 2018 - IEEE 44th European Solid State Circuits Conference

Conference

Conference	44th IEEE European Solid State Circuits Conference, ESSCIRC 2018
Country/Territory	Germany
City	Dresden
Period	3/09/18 → 6/09/18

Keywords

Analog
Hotspot
Microprocessors
Thermal Management
Thermal Sensor

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Instrumentation

Access to Document

10.1109/ESSCIRC.2018.8494268

Cite this

Bass, O., & Shor, J. (2018). Ultra-Miniature 0.003 mm² PNP-Based Thermal Sensor for CPU Thermal Monitoring. In ESSCIRC 2018 - IEEE 44th European Solid State Circuits Conference (pp. 110-113). Article 8494268 (ESSCIRC 2018 - IEEE 44th European Solid State Circuits Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ESSCIRC.2018.8494268

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abstract = "Miniaturized, integrated thermal sensors are utilized to measure hot and cold spots in CPU's in multiple locations and are critical for the power/performance of the chip. In this paper we report an ultra-miniature, 0.003 mm2, PNP thermal sensor in TSMC 65nm. The sensor utilizes a novel switched-capacitor bandgap reference and a single bit sigma-delta modulator to achieve a maximum error of ±1.35°C and a resolution of 130mK for a 12 bit, 4ms conversion. The sensor is the smallest reported BJT bandgap-based sensor, especially when considering the process node, and one of the smallest in all mechanisms. It has a competitive accuracy and resolution compared to compact bandgap-based sensors which can meet the CPU area specifications (< 0.02 mm2).",

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Bass, O & Shor, J 2018, Ultra-Miniature 0.003 mm² PNP-Based Thermal Sensor for CPU Thermal Monitoring. in ESSCIRC 2018 - IEEE 44th European Solid State Circuits Conference., 8494268, ESSCIRC 2018 - IEEE 44th European Solid State Circuits Conference, Institute of Electrical and Electronics Engineers Inc., pp. 110-113, 44th IEEE European Solid State Circuits Conference, ESSCIRC 2018, Dresden, Germany, 3/09/18. https://doi.org/10.1109/ESSCIRC.2018.8494268

Ultra-Miniature 0.003 mm² PNP-Based Thermal Sensor for CPU Thermal Monitoring. / Bass, Ori; Shor, Joseph.
ESSCIRC 2018 - IEEE 44th European Solid State Circuits Conference. Institute of Electrical and Electronics Engineers Inc., 2018. p. 110-113 8494268 (ESSCIRC 2018 - IEEE 44th European Solid State Circuits Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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