Towards a new simulation testbed for semiconductor manufacturing

Michael Hassoun; Adar Kalir

doi:10.1109/WSC.2017.8248074

Towards a new simulation testbed for semiconductor manufacturing

Michael Hassoun, Adar Kalir

Ariel University, Ben-Gurion University of the Negev

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

We propose the creation of a new set of fab simulation testbeds. Extensions and additional features, not considered in the original MIMAC datasets, shall be incorporated in these new testbeds, thus allowing researchers to evaluate new methodologies with the same frame of reference. To do this, we surveyed the literature and mapped the pertinent research efforts of the past two decades. In this paper, we discuss in detail the various aspects of the new testbeds, in order to receive feedback from the simulation community on the importance of inclusion of some of the items in question; and the verification of the required inclusion of other items. Given the feedback, we aim to generate these testbeds within a year to serve as the new frame of reference for the benefit of the entire semiconductor manufacturing simulation community.

Original language	English
Title of host publication	2017 Winter Simulation Conference, WSC 2017
Editors	Victor Chan
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	3612-3623
Number of pages	12
ISBN (Electronic)	9781538634288
DOIs	https://doi.org/10.1109/WSC.2017.8248074
State	Published - 28 Jun 2017
Event	2017 Winter Simulation Conference, WSC 2017 - Las Vegas, United States Duration: 3 Dec 2017 → 6 Dec 2017

Publication series

Name	Proceedings - Winter Simulation Conference

Conference

Conference	2017 Winter Simulation Conference, WSC 2017
Country/Territory	United States
City	Las Vegas
Period	3/12/17 → 6/12/17

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

All Science Journal Classification (ASJC) codes

Software
Computer Science Applications
Modelling and Simulation

Access to Document

10.1109/WSC.2017.8248074

Cite this

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title = "Towards a new simulation testbed for semiconductor manufacturing",

abstract = "We propose the creation of a new set of fab simulation testbeds. Extensions and additional features, not considered in the original MIMAC datasets, shall be incorporated in these new testbeds, thus allowing researchers to evaluate new methodologies with the same frame of reference. To do this, we surveyed the literature and mapped the pertinent research efforts of the past two decades. In this paper, we discuss in detail the various aspects of the new testbeds, in order to receive feedback from the simulation community on the importance of inclusion of some of the items in question; and the verification of the required inclusion of other items. Given the feedback, we aim to generate these testbeds within a year to serve as the new frame of reference for the benefit of the entire semiconductor manufacturing simulation community.",

author = "Michael Hassoun and Adar Kalir",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 Winter Simulation Conference, WSC 2017 ; Conference date: 03-12-2017 Through 06-12-2017",

year = "2017",

month = jun,

day = "28",

doi = "10.1109/WSC.2017.8248074",

language = "الإنجليزيّة",

series = "Proceedings - Winter Simulation Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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editor = "Victor Chan",

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}

Hassoun, M & Kalir, A 2017, Towards a new simulation testbed for semiconductor manufacturing. in V Chan (ed.), 2017 Winter Simulation Conference, WSC 2017. Proceedings - Winter Simulation Conference, Institute of Electrical and Electronics Engineers Inc., pp. 3612-3623, 2017 Winter Simulation Conference, WSC 2017, Las Vegas, United States, 3/12/17. https://doi.org/10.1109/WSC.2017.8248074

Towards a new simulation testbed for semiconductor manufacturing. / Hassoun, Michael; Kalir, Adar.
2017 Winter Simulation Conference, WSC 2017. ed. / Victor Chan. Institute of Electrical and Electronics Engineers Inc., 2017. p. 3612-3623 (Proceedings - Winter Simulation Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Towards a new simulation testbed for semiconductor manufacturing

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AU - Kalir, Adar

PY - 2017/6/28

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N2 - We propose the creation of a new set of fab simulation testbeds. Extensions and additional features, not considered in the original MIMAC datasets, shall be incorporated in these new testbeds, thus allowing researchers to evaluate new methodologies with the same frame of reference. To do this, we surveyed the literature and mapped the pertinent research efforts of the past two decades. In this paper, we discuss in detail the various aspects of the new testbeds, in order to receive feedback from the simulation community on the importance of inclusion of some of the items in question; and the verification of the required inclusion of other items. Given the feedback, we aim to generate these testbeds within a year to serve as the new frame of reference for the benefit of the entire semiconductor manufacturing simulation community.

AB - We propose the creation of a new set of fab simulation testbeds. Extensions and additional features, not considered in the original MIMAC datasets, shall be incorporated in these new testbeds, thus allowing researchers to evaluate new methodologies with the same frame of reference. To do this, we surveyed the literature and mapped the pertinent research efforts of the past two decades. In this paper, we discuss in detail the various aspects of the new testbeds, in order to receive feedback from the simulation community on the importance of inclusion of some of the items in question; and the verification of the required inclusion of other items. Given the feedback, we aim to generate these testbeds within a year to serve as the new frame of reference for the benefit of the entire semiconductor manufacturing simulation community.

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EP - 3623

BT - 2017 Winter Simulation Conference, WSC 2017

A2 - Chan, Victor

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2017 Winter Simulation Conference, WSC 2017

Y2 - 3 December 2017 through 6 December 2017

ER -

Towards a new simulation testbed for semiconductor manufacturing

Abstract

Publication series

Conference

UN SDGs

All Science Journal Classification (ASJC) codes

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