Thermal-Aware Channel Capacity

Yeow Meng Chee, Tuvi Etzion, Kees A. Schouhamer Immink, Tuan Thanh Nguyen, Van Khu Vu, Jos H. Weber, Eitan Yaakobi

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

High temperatures in electronic devices have a negative effect on their performance. Various techniques have been proposed and studied to address and combat this thermal challenge. To guarantee that the peak temperature of the devices will be bounded by some maximum temperature, the transmitted signal has to satisfy some constraints.With this motivation, we study the constrained channel that only accepts sequences that satisfy prescribed thermal constraints. The main goal in this paper is to compute the capacity of this channel. We provide the exact capacity of the channel with some certain parameters and we also present some bounds on the capacity in various cases.Finally, we consider the model that multiple wires are available to use and find out the smallest number of wires required to satisfy the thermal constraints.

Original languageEnglish
Title of host publication2023 IEEE International Symposium on Information Theory, ISIT 2023
Pages2661-2666
Number of pages6
ISBN (Electronic)9781665475549
DOIs
StatePublished - 2023
Event2023 IEEE International Symposium on Information Theory, ISIT 2023 - Taipei, Taiwan, Province of China
Duration: 25 Jun 202330 Jun 2023

Publication series

NameIEEE International Symposium on Information Theory - Proceedings
Volume2023-June

Conference

Conference2023 IEEE International Symposium on Information Theory, ISIT 2023
Country/TerritoryTaiwan, Province of China
CityTaipei
Period25/06/2330/06/23

All Science Journal Classification (ASJC) codes

  • Theoretical Computer Science
  • Information Systems
  • Modelling and Simulation
  • Applied Mathematics

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