The effect of bismuth on microstructure evolution of ultrafine grained copper

A. Kosinova, B. B. Straumal, A. R. Kilmametov, E. Rabkin

Research output: Contribution to journalArticlepeer-review

Abstract

The effect of bismuth on the microstructure evolution of ultrafine grained copper at elevated temperatures has been studied. Ultrafine grained copper polycrystals were produced employing the High-Pressure Torsion technique. Bismuth had little effect on kinetics of recrystallization and grain growth of as-processed copper. Bi-rich intergranular films at the grain boundaries were observed in the samples annealed between 700 and 900 °C. Complete wetting of the grain boundary triple junctions by the Bi-rich liquid phase was observed at the temperatures below the onset of complete grain boundary wetting. We attributed the fact that Bi does not affect the kinetics of grain growth to the abundance of twin boundaries not affected by Bi segregation.

Original languageEnglish
Pages (from-to)156-159
Number of pages4
JournalMaterials Letters
Volume199
DOIs
StatePublished - 15 Jul 2017

Keywords

  • Bismuth
  • Copper
  • Grain boundaries
  • Grain growth
  • Kinetics
  • Nano-crystalline metals
  • Thermodynamics

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • General Materials Science

Fingerprint

Dive into the research topics of 'The effect of bismuth on microstructure evolution of ultrafine grained copper'. Together they form a unique fingerprint.

Cite this