The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum

Rimma Lapovok; Alex Berner; Yuanshen Qi; Chunjee Xu; Eugen Rabkin; Yan Beygelzimer

doi:10.1002/adem.202000058

The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum

Rimma Lapovok, Alex Berner, Yuanshen Qi, Chunjee Xu, Eugen Rabkin, Yan Beygelzimer

Technion - Israel Institute of Technology

Research output: Contribution to journal › Article › peer-review

Abstract

Aluminum powder blended with 10, 20, and 30 wt% of copper powder is compacted at 400 °C by four reciprocal extrusion passes. Simultaneous compaction and strengthening result in more than double increase in mechanical strength characteristics for 20 and 30 wt% of copper and a significant increase in electrical conductivity for 30 wt% of copper. This phenomenon is investigated here by the expansion of the “effective media” model for a random binary mixture so that it includes the presence of intermetallic phases and considers the distribution of large copper agglomerates.

Original language	English
Article number	2000058
Journal	Advanced Engineering Materials
Volume	22
Issue number	6
DOIs	https://doi.org/10.1002/adem.202000058
State	Published - 1 Jun 2020

Keywords

conductivities
copper–aluminum hybrid materials
interfaces
intermetallics
powder compaction
reciprocal extrusions

All Science Journal Classification (ASJC) codes

Condensed Matter Physics
General Materials Science

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10.1002/adem.202000058

Cite this

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title = "The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum",

abstract = "Aluminum powder blended with 10, 20, and 30 wt% of copper powder is compacted at 400 °C by four reciprocal extrusion passes. Simultaneous compaction and strengthening result in more than double increase in mechanical strength characteristics for 20 and 30 wt% of copper and a significant increase in electrical conductivity for 30 wt% of copper. This phenomenon is investigated here by the expansion of the “effective media” model for a random binary mixture so that it includes the presence of intermetallic phases and considers the distribution of large copper agglomerates.",

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author = "Rimma Lapovok and Alex Berner and Yuanshen Qi and Chunjee Xu and Eugen Rabkin and Yan Beygelzimer",

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AU - Lapovok, Rimma

AU - Berner, Alex

AU - Qi, Yuanshen

AU - Xu, Chunjee

AU - Rabkin, Eugen

AU - Beygelzimer, Yan

PY - 2020/6/1

Y1 - 2020/6/1

N2 - Aluminum powder blended with 10, 20, and 30 wt% of copper powder is compacted at 400 °C by four reciprocal extrusion passes. Simultaneous compaction and strengthening result in more than double increase in mechanical strength characteristics for 20 and 30 wt% of copper and a significant increase in electrical conductivity for 30 wt% of copper. This phenomenon is investigated here by the expansion of the “effective media” model for a random binary mixture so that it includes the presence of intermetallic phases and considers the distribution of large copper agglomerates.

AB - Aluminum powder blended with 10, 20, and 30 wt% of copper powder is compacted at 400 °C by four reciprocal extrusion passes. Simultaneous compaction and strengthening result in more than double increase in mechanical strength characteristics for 20 and 30 wt% of copper and a significant increase in electrical conductivity for 30 wt% of copper. This phenomenon is investigated here by the expansion of the “effective media” model for a random binary mixture so that it includes the presence of intermetallic phases and considers the distribution of large copper agglomerates.

KW - conductivities

KW - copper–aluminum hybrid materials

KW - interfaces

KW - intermetallics

KW - powder compaction

KW - reciprocal extrusions

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M3 - مقالة

SN - 1438-1656

VL - 22

JO - Advanced Engineering Materials

JF - Advanced Engineering Materials

IS - 6

M1 - 2000058

ER -

The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum

Abstract

Keywords

All Science Journal Classification (ASJC) codes

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