Studying the effects of chemistry and geometry on DSA hole-shrink process in three dimensions

Chun Zhou, Tsuyoshi Kurosawa, Takahiro Dazai, Jan Doise, Jiaxing Ren, Cody Bezik, Tamar Segal-Peretz, Akiyoshi Yamazaki, Roel Gronheid, Paulina Rincon-Delgadillo, Juan De Pablo, Paul F. Nealey

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Acquiring three-dimensional information becomes increasingly important for the development of block copolymer (BCP) directed self-assembly (DSA) lithography, as 2D imaging is no longer sufficient to describe the 3D nature of DSA morphology and probe hidden structures under the surface. In this study, using post-DSA membrane fabrication technique and STEM (scanning transmission electron microscopy) tomography we were able to characterize the 3D structures of BCP in graphoepitaxial DSA hole shrink process. Different DSA structures of singlets formed in templated holes with different surface chemistry and geometry were successfully captured and their 3D shapes were reconstructed from tomography data. The results reveal that strong PS-preferential sidewalls are necessary to create vertical DSA cylinders and that template size outside of process window could result in defective DSA results in three dimensions. Our study as well as the established 3D metrology would greatly help to develop a fundamental understanding of the key DSA factors for optimization of the graphoepitaxial hole shrink process.

Original languageEnglish
Title of host publicationNovel Patterning Technologies 2018
EditorsMartha I. Sanchez, Eric M. Panning
ISBN (Electronic)9781510616608
DOIs
StatePublished - 2018
EventNovel Patterning Technologies 2018 - San Jose, United States
Duration: 26 Feb 20181 Mar 2018

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume10584

Conference

ConferenceNovel Patterning Technologies 2018
Country/TerritoryUnited States
CitySan Jose
Period26/02/181/03/18

Keywords

  • 3D reconstruction
  • block copolymer
  • defectivity
  • directed self-assembly
  • hole shrink
  • tomography

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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