@inproceedings{0dcff29eba0d478d9c951d3362fadb0c,
title = "Statistical degradation in BGAs for early fault detection",
abstract = "Here, a method for statistical analysis of BGA pin degradation in packaged devices is presented. A novel testing system is demonstrated featuring parallel monitoring of numerous pins, fast thermal cycling, and precise degradation data generation even in moderate stresses. The resistance change data due to temperature cycling stress is compared to stress on the pin due to location on the chip. The results are vital for localizing vulnerabilities in pins not location specific in the chip. The methods introduced in this study can be expanded to analyze advanced packaging assemblies.",
author = "Emmanuel Bender and Tsuriel Avraham and Bernstein, {Joseph B.} and Boning, {Duane S.}",
note = "Publisher Copyright: {\textcopyright} 2024 ASM International{\textregistered}; 50th International Symposium for Testing and Failure Analysis Conference, ISTFA 2024 ; Conference date: 28-10-2024 Through 01-11-2024",
year = "2024",
doi = "10.31399/asm.cp.istfa2024p0440",
language = "الإنجليزيّة",
series = "Conference Proceedings from the International Symposium for Testing and Failure Analysis",
publisher = "ASM International",
pages = "440--446",
booktitle = "ISTFA 2024",
address = "الولايات المتّحدة",
}