SORBATE-CONTAINING COMPOSITIONS FOR USE IN COPPER CHEMICAL MECHANICAL PLANARIZATION

Yair Ein-Eli; David Starosvetsky; Margalit Nagar, Magi

SORBATE-CONTAINING COMPOSITIONS FOR USE IN COPPER CHEMICAL MECHANICAL PLANARIZATION

Yair Ein-Eli (Inventor), David Starosvetsky (Inventor), Margalit Nagar, Magi (Inventor)

Materials Science & Engineering

Technion - Israel Institute of Technology

Research output: Patent

Abstract

Disclosed are copper CMP compositions containing a high concentration of sorbate anion. Further disclosed are processes of planarizing a copper-containing surface using the compositions, as well as substrates and articles having planarized copper-containing elements produced by the disclosed processes.

Original language	American English
Patent number	WO2011083475
IPC	H01L 21/ 321 A I
Priority date	7/01/10
State	Published - 14 Jul 2011

Cite this

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title = "SORBATE-CONTAINING COMPOSITIONS FOR USE IN COPPER CHEMICAL MECHANICAL PLANARIZATION",

abstract = "Disclosed are copper CMP compositions containing a high concentration of sorbate anion. Further disclosed are processes of planarizing a copper-containing surface using the compositions, as well as substrates and articles having planarized copper-containing elements produced by the disclosed processes.",

author = "Yair Ein-Eli and David Starosvetsky and {Nagar, Magi}, Margalit",

year = "2011",

month = jul,

day = "14",

language = "American English",

type = "Patent",

note = "WO2011083475; H01L 21/ 321 A I",

}

TY - PAT

T1 - SORBATE-CONTAINING COMPOSITIONS FOR USE IN COPPER CHEMICAL MECHANICAL PLANARIZATION

AU - Ein-Eli, Yair

AU - Starosvetsky, David

AU - Nagar, Magi, Margalit

PY - 2011/7/14

Y1 - 2011/7/14

N2 - Disclosed are copper CMP compositions containing a high concentration of sorbate anion. Further disclosed are processes of planarizing a copper-containing surface using the compositions, as well as substrates and articles having planarized copper-containing elements produced by the disclosed processes.

AB - Disclosed are copper CMP compositions containing a high concentration of sorbate anion. Further disclosed are processes of planarizing a copper-containing surface using the compositions, as well as substrates and articles having planarized copper-containing elements produced by the disclosed processes.

M3 - Patent

M1 - WO2011083475

ER -