PROCESS FOR ELECTROPLATING OF COPPER

Yair Ein-Eli; Nina Sezin; David Starosvetsky

PROCESS FOR ELECTROPLATING OF COPPER

Yair Ein-Eli (Inventor)
, Nina Sezin (Inventor)
, David Starosvetsky (Inventor)

Materials Science & Engineering

Technion - Israel Institute of Technology

Research output: Patent

Abstract

A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.

Original language	English
Patent number	US2012028073
IPC	C25D 5/ 34 A I
Priority date	11/02/10
State	Published - 2 Feb 2012

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title = "PROCESS FOR ELECTROPLATING OF COPPER",

abstract = "A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.",

author = "Yair Ein-Eli and Nina Sezin and David Starosvetsky",

year = "2012",

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day = "2",

language = "English",

type = "Patent",

note = "US2012028073; C25D 5/ 34 A I",

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AU - Sezin, Nina

AU - Starosvetsky, David

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N2 - A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.

AB - A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.

M3 - Patent

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PROCESS FOR ELECTROPLATING OF COPPER

Abstract

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