Printing a Self-Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity

The patterning of various 2D and 3D substrates is accomplished using a a new method, reactive transfer printing, combined with a self-reducing copper precursor. The ink composed of the metal precursor is printed on a donor substrate; during its decomposition, the metal is transferred to an acceptor substrate. This process is demonstrated with copper formate as the precursor, forming a copper pattern with excellent conductivity (50% that of bulk copper).