Metrology of DSA process using TEM tomography

Tamar Segal-Peretz, Jonathan Winterstein, Jiaxing Ren, Mahua Biswas, J. Alexander Liddle, Jeffery W. Elam, Leonidas E. Ocola, Ralu N.S. Divan, Nestor Zaluzec, Paul F. Nealey

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Directed self-assembly (DSA) of block copolymers (BCPs) is a rising technique for sub-20 nm patterning. To fully harness DSA capabilities for patterning, a detailed understanding of the three dimensional (3D) structure of BCPs is needed. By combining sequential infiltration synthesis (SIS) and scanning transmission electron microscopy (STEM) tomography, we have characterized the 3D structure of self-assembled and DSA BCPs films with high precision and resolution. SIS is an emerging technique for enhancing pattern transfer in BCPs through the selective growth of inorganic material in polar BCP domains. Here, Al2O3 SIS was used to enhance the imaging contrast and enable tomographic characterization of BCPs with high fidelity. Moreover, by utilizing SIS for both 3D characterization and hard mask fabrication, we were able to characterize the BCP morphology as well as the alumina nanostructures that would be used for pattern transfer.

Original languageEnglish
Title of host publicationMetrology, Inspection, and Process Control for Microlithography XXIX
EditorsMartha I. Sanchez, Jason P. Cain
ISBN (Electronic)9781628415261
DOIs
StatePublished - 2015
Externally publishedYes
Event29th Conference on Metrology, Inspection, and Process Control for Microlithography - San Jose, United States
Duration: 23 Feb 201526 Feb 2015

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9424

Conference

Conference29th Conference on Metrology, Inspection, and Process Control for Microlithography
Country/TerritoryUnited States
CitySan Jose
Period23/02/1526/02/15

Keywords

  • 3D characterization
  • Block copolymers
  • DSA
  • SIS
  • STEM
  • TEM
  • self-assembly
  • tomography

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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