Abstract
In various embodiments, a cooling device for dissipating heat generated in an electronic or electrochemical device includes a substrate, multiple benders arranged on the substrate, and supply circuitry for supplying an electric field to actuate the benders for causing movement thereof, thereby producing an air flow.
| Original language | English |
|---|---|
| Patent number | WO2016075535 |
| IPC | H10N 30/ 081 A I |
| Priority date | 10/11/14 |
| State | Published - 19 May 2016 |
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