MEMS-BASED ACTIVE COOLING SYSTEM

Eran Fine; Viacheslav Krylov; Yosi Shacham-Diamand; Ekaterina Axelrod; Mordechai Ben-David; Ziv Hermon

MEMS-BASED ACTIVE COOLING SYSTEM

Eran Fine (Inventor), Viacheslav Krylov (Inventor), Yosi Shacham-Diamand (Inventor), Ekaterina Axelrod (Inventor), Mordechai Ben-David (Inventor), Ziv Hermon (Inventor)

Tel Aviv University

Research output: Patent

Abstract

In various embodiments, a cooling device for dissipating heat generated in an electronic or electrochemical device includes a substrate, multiple benders arranged on the substrate, and supply circuitry for supplying an electric field to actuate the benders for causing movement thereof, thereby producing an air flow.

Original language	American English
Patent number	WO2016075535
IPC	H10N 30/ 081 A I
Priority date	10/11/14
State	Published - 19 May 2016

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title = "MEMS-BASED ACTIVE COOLING SYSTEM",

abstract = "In various embodiments, a cooling device for dissipating heat generated in an electronic or electrochemical device includes a substrate, multiple benders arranged on the substrate, and supply circuitry for supplying an electric field to actuate the benders for causing movement thereof, thereby producing an air flow.",

author = "Eran Fine and Viacheslav Krylov and Yosi Shacham-Diamand and Ekaterina Axelrod and Mordechai Ben-David and Ziv Hermon",

year = "2016",

month = may,

day = "19",

language = "American English",

type = "Patent",

note = "WO2016075535; H10N 30/ 081 A I",

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TY - PAT

T1 - MEMS-BASED ACTIVE COOLING SYSTEM

AU - Fine, Eran

AU - Krylov, Viacheslav

AU - Shacham-Diamand, Yosi

AU - Axelrod, Ekaterina

AU - Ben-David, Mordechai

AU - Hermon, Ziv

PY - 2016/5/19

Y1 - 2016/5/19

N2 - In various embodiments, a cooling device for dissipating heat generated in an electronic or electrochemical device includes a substrate, multiple benders arranged on the substrate, and supply circuitry for supplying an electric field to actuate the benders for causing movement thereof, thereby producing an air flow.

AB - In various embodiments, a cooling device for dissipating heat generated in an electronic or electrochemical device includes a substrate, multiple benders arranged on the substrate, and supply circuitry for supplying an electric field to actuate the benders for causing movement thereof, thereby producing an air flow.

M3 - Patent

M1 - WO2016075535

ER -

MEMS-BASED ACTIVE COOLING SYSTEM

Abstract

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