@inproceedings{335a77287ad440c1ab2f989cd0b95d9c,
title = "Low-profile fully integrated 60 GHz 18 element phased array on multilayer liquid crystal polymer flip chip package",
abstract = "We present an ultra-thin, low cost, fully integrated 60GHz phased array antenna module supporting 18 TX/RX antenna elements for 60 GHz WiGig applications. The RFIC is assembled on a 15 mm × 12 mm liquid crystal polymer (LCP) package containing the antenna elements. All millimeter-wave signal routing was done on the same layer as the die pads to minimize the number of package substrate layers (4 total metal layers) and achieve very small total package thickness of 0.41 mm. The measurement results for the package showed good agreement with the simulation. The measured peak directivity of the steerable array was 17.4 dBi and routing losses were 0.5 - 1dB.",
author = "Telesphor Kamgaing and Elsherbini, {Adel A.} and Oster, {Sasha N.} and Emanuel Cohen",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 ; Conference date: 26-05-2015 Through 29-05-2015",
year = "2015",
month = jul,
day = "15",
doi = "10.1109/ECTC.2015.7159716",
language = "الإنجليزيّة",
series = "Proceedings - Electronic Components and Technology Conference",
pages = "994--998",
booktitle = "2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015",
}