Low-profile fully integrated 60 GHz 18 element phased array on multilayer liquid crystal polymer flip chip package

Telesphor Kamgaing, Adel A. Elsherbini, Sasha N. Oster, Emanuel Cohen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

We present an ultra-thin, low cost, fully integrated 60GHz phased array antenna module supporting 18 TX/RX antenna elements for 60 GHz WiGig applications. The RFIC is assembled on a 15 mm × 12 mm liquid crystal polymer (LCP) package containing the antenna elements. All millimeter-wave signal routing was done on the same layer as the die pads to minimize the number of package substrate layers (4 total metal layers) and achieve very small total package thickness of 0.41 mm. The measurement results for the package showed good agreement with the simulation. The measured peak directivity of the steerable array was 17.4 dBi and routing losses were 0.5 - 1dB.

Original languageEnglish
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
Pages994-998
Number of pages5
ISBN (Electronic)9781479986095
DOIs
StatePublished - 15 Jul 2015
Externally publishedYes
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: 26 May 201529 May 2015

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2015-July

Conference

Conference2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
Country/TerritoryUnited States
CitySan Diego
Period26/05/1529/05/15

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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