Abstract
The synchronized lateral spreading and through-penetration of liquid and solid gallium (Ga) in supported thin polycrystalline films of silver (Ag) were studied. The spreading and penetration kinetics were presumably controlled by a common mechanism. The spreading rate in the 0.5 μm thick film was found to be constant with time. The activation energies of the process responsible for spreading/penetration of liquid and solid Ga were EL ≈ 28.9 ± 4.8 kJ mol-1 and ES ≈ 48.2 ± 9.6 kJ mol-1, respectively. Grain boundary grooving, with Ag diffusion out of the groove either through liquid Ga or through solid Ga, was suggested as a possible mechanism of the spreading and penetration. The model proposed reproduced the observed spreading/penetration rates and gave reasonable estimates of the energies ES and EL.
Original language | English |
---|---|
Pages (from-to) | 914-926 |
Number of pages | 13 |
Journal | Acta Materialia |
Volume | 59 |
Issue number | 3 |
DOIs | |
State | Published - Feb 2011 |
Keywords
- Gallium
- Grain boundary diffusion
- Silver
- Thin films
- Wetting
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Ceramics and Composites
- Polymers and Plastics
- Metals and Alloys