Ink-jet printed copper complex MOD ink for plastic electronics

Yousef Farraj, Michael Grouchko, Shlomo Magdassi, Fritz Koch, Mirko Wittkötter, Maik Müller, Ingo Reinhold, Werner Zapka

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The development of highly conductive copper patterns on low-cost flexible substrates (PET, PEN, etc.) by inkjet printing is reported. Copper films were obtained from a metallo-organic decomposition (MOD) ink composed of a copper complex and suitable low-viscosity solvents. Upon heating the ink decomposed and was converted into metallic copper under nitrogen as inert atmosphere. Additionally samples were prepared using inkjet technology on various substrates. The required layer thickness for current conduction was assessed by printing on PET and sintering at 150°C in a vacuum oven.

Original languageEnglish
Title of host publicationNIP 2014
Subtitle of host publication30th International Conference on Digital Printing Technologies and Digital Fabrication 2014
PublisherSociety for Imaging Science and Technology
Pages191-193
Number of pages3
ISBN (Electronic)9780892083114
StatePublished - 2014
Event30th International Conference on Digital Printing Technologies and Digital Fabrication 2014, NIP 2014 - Philadelphia, United States
Duration: 7 Sep 201411 Sep 2014

Publication series

NameInternational Conference on Digital Printing Technologies
Volume2014-January

Conference

Conference30th International Conference on Digital Printing Technologies and Digital Fabrication 2014, NIP 2014
Country/TerritoryUnited States
CityPhiladelphia
Period7/09/1411/09/14

All Science Journal Classification (ASJC) codes

  • Media Technology
  • Computer Science Applications

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