@inproceedings{aa719edc61d3448c8bc9f4e2bc610dfc,
title = "Improvement in QCN with BIER for Chassis Topology",
abstract = "In the present era, networking has become an essential requirement as individuals seek interconnectivity and efficient means to share data rapidly. When discussing the swift exchange of information, a network characterized by high speed and minimal congestion is favored by all. In networking, Switches play a very important role to transfer packets of information from source to destination, as routers do in any network topology. For switches to exchange data from the source port of one switch to the destination port of another switch, it requires a special arrangement where every switch is connected to another using chassis topology. When packets transfer, in certain cases, it leads to congestion in the output port due to heavy traffic. A method for resolving the congestion is by signaling to the source port(s), sending the traffic causing the congestion, to throttle the traffic towards the congested port. One such signaling may be based on Quantized Congestion Notification (QCN). As the packets might be received from different sources, the notification needs to be replicated to a subset of the source ports sending to the congested target. This paper proposes the analysis of QCN signaling within a chassis topology, based on different cases using an advanced replication architecture i.e., BIER (Bit Index Explicit Replication) to study its effect to achieve high throughput and low latency of the whole system and proposes a novel approach called periodic QCN for handling persistent congestion.",
keywords = "BIER, Chassis topology, Networking, Periodic QCN, QCN, Switch",
author = "Shivani Sharma and Ramalingaswamy Cheruku and Yuval Peled and Prakash Kodali and Venkatesh Gudipadu and Shai Savir",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 38th IEEE Region 10 Conference, TENCON 2023 ; Conference date: 31-10-2023 Through 03-11-2023",
year = "2023",
doi = "10.1109/tencon58879.2023.10322386",
language = "الإنجليزيّة",
series = "IEEE Region 10 Annual International Conference, Proceedings/TENCON",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "81--86",
booktitle = "TENCON 2023 - 2023 IEEE Region 10 Conference",
address = "الولايات المتّحدة",
}