@inproceedings{aebe750e6ab140a6bbfe00bc02072be0,
title = "Enhancing EMI-Packaging to Protect Against Fault Injection and Side-Channel Attacks",
abstract = "Many countermeasures at many hierarchical levels have been developed over the years by researchers and companies in order to handle passive side-channel analysis and active fault-injection attacks. This paper focuses on shielding-based solutions to mitigate the leaking electromagnetic information that can be exploited by an SCA attacker, and in solutions aiming to prevent information extraction by FI attacks. A review of the main protection schemes utilizing shields in various physical layers is provided. Furthermore, a novel in-package countermeasure architecture is presented, relying on existing packaging-industry technologies, with security criteria consideration.",
keywords = "Design for Manufacturing (DFM), Electromagnetic Compatibility (EMC), Electromagnetic Interference (EMI), Fault Injection Attacks (FIA), Packaging, Radio-Frequency Interference (RFI), Shielding, Side-Channel Attacks (SCA)",
author = "Moshe Avital and Gil Weisman and Doron Moscovitz and Itamar Levi",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024 ; Conference date: 09-07-2024 Through 11-07-2024",
year = "2024",
doi = "https://doi.org/10.1109/comcas58210.2024.10666234",
language = "الإنجليزيّة",
series = "2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024",
address = "الولايات المتّحدة",
}