@inproceedings{dd7977281f114f978d75165f669390ad,
title = "Electroless Plating with Copper Complex Ink as a Seed",
abstract = "Electroless or electrolytic deposition processes require the use of a very costly catalyst, usually palladium, as a seed material. Here we present the use of a copper complex as a very efficient replacement for the conventional catalysts, which can be directly printed by various technologies such as screen, gravure, and inkjet, on both 2D and 3D substrates. The copper complex can be reduced to pure copper upon short exposure to low-temperature plasma, by heating under inert atmosphere or via photonic sintering. By combining the complex with electroless plating (EP), a resistivity as low as 2.38.cm",
author = "Chew, \{Kai Hwa\} and Yousef Farraj and Shlomo Magdassi",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 22nd IEEE Electronics Packaging Technology Conference, EPTC 2020 ; Conference date: 02-12-2020 Through 04-12-2020",
year = "2020",
month = dec,
day = "2",
doi = "10.1109/EPTC50525.2020.9315010",
language = "الإنجليزيّة",
series = "2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "36--40",
booktitle = "2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020",
address = "الولايات المتّحدة",
}