Effect of SPD Processing on the Strength and Conductivity of AA6061 Alloy

Yuanshen Qi; Anna Kosinova; Eugene Lakin; Vladimir V. Popov; Eugen Rabkin; Rimma Lapovok

doi:10.1002/adem.201801370

Effect of SPD Processing on the Strength and Conductivity of AA6061 Alloy

Yuanshen Qi, Anna Kosinova, Eugene Lakin, Vladimir V. Popov, Eugen Rabkin, Rimma Lapovok

Technion - Israel Institute of Technology

Research output: Contribution to journal › Article › peer-review

Abstract

The extruded and artificially aged at 177 °C high strength commercial alloy AA6061-T651 is subjected to severe plastic deformation (SPD) by cyclic extrusion up to 1000% of the true strain at 400 °C. Unexpectedly, the electrical conductivity of the deformed alloy increased by 10% International Annealed Copper Standard (IACS), while the hardness dropped by only 40 HV. Further, it is shown that low temperature aging at 130 °C after SPD results in the following phenomena: the hardness of the alloy is restored almost to the initial level, with a slight decrease in conductivity, which still remained higher than in the original state. All microstructural parameters of the alloy including aluminum matrix composition, grain size, grain boundaries fraction, and morphology of the precipitates are characterized and correlated with the observed effect of SPD on the strength and electrical conductivity of alloy AA6061.

Original language	English
Article number	1801370
Journal	Advanced Engineering Materials
Volume	21
Issue number	8
DOIs	https://doi.org/10.1002/adem.201801370
State	Published - Aug 2019

Keywords

aging
aluminum alloy AA6061
mechanical and electrical properties
severe plastic deformation

All Science Journal Classification (ASJC) codes

General Materials Science
Condensed Matter Physics

Access to Document

10.1002/adem.201801370

Cite this

@article{9a253bbdd87e44339efbdde7b12da3c5,

title = "Effect of SPD Processing on the Strength and Conductivity of AA6061 Alloy",

abstract = "The extruded and artificially aged at 177 °C high strength commercial alloy AA6061-T651 is subjected to severe plastic deformation (SPD) by cyclic extrusion up to 1000% of the true strain at 400 °C. Unexpectedly, the electrical conductivity of the deformed alloy increased by 10% International Annealed Copper Standard (IACS), while the hardness dropped by only 40 HV. Further, it is shown that low temperature aging at 130 °C after SPD results in the following phenomena: the hardness of the alloy is restored almost to the initial level, with a slight decrease in conductivity, which still remained higher than in the original state. All microstructural parameters of the alloy including aluminum matrix composition, grain size, grain boundaries fraction, and morphology of the precipitates are characterized and correlated with the observed effect of SPD on the strength and electrical conductivity of alloy AA6061.",

keywords = "aging, aluminum alloy AA6061, mechanical and electrical properties, severe plastic deformation",

author = "Yuanshen Qi and Anna Kosinova and Eugene Lakin and Popov, {Vladimir V.} and Eugen Rabkin and Rimma Lapovok",

note = "Publisher Copyright: {\textcopyright} 2019 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim",

year = "2019",

month = aug,

doi = "10.1002/adem.201801370",

language = "الإنجليزيّة",

volume = "21",

journal = "Advanced Engineering Materials",

issn = "1438-1656",

publisher = "Wiley-VCH Verlag",

number = "8",

}

TY - JOUR

T1 - Effect of SPD Processing on the Strength and Conductivity of AA6061 Alloy

AU - Qi, Yuanshen

AU - Kosinova, Anna

AU - Lakin, Eugene

AU - Popov, Vladimir V.

AU - Rabkin, Eugen

AU - Lapovok, Rimma

PY - 2019/8

Y1 - 2019/8

N2 - The extruded and artificially aged at 177 °C high strength commercial alloy AA6061-T651 is subjected to severe plastic deformation (SPD) by cyclic extrusion up to 1000% of the true strain at 400 °C. Unexpectedly, the electrical conductivity of the deformed alloy increased by 10% International Annealed Copper Standard (IACS), while the hardness dropped by only 40 HV. Further, it is shown that low temperature aging at 130 °C after SPD results in the following phenomena: the hardness of the alloy is restored almost to the initial level, with a slight decrease in conductivity, which still remained higher than in the original state. All microstructural parameters of the alloy including aluminum matrix composition, grain size, grain boundaries fraction, and morphology of the precipitates are characterized and correlated with the observed effect of SPD on the strength and electrical conductivity of alloy AA6061.

AB - The extruded and artificially aged at 177 °C high strength commercial alloy AA6061-T651 is subjected to severe plastic deformation (SPD) by cyclic extrusion up to 1000% of the true strain at 400 °C. Unexpectedly, the electrical conductivity of the deformed alloy increased by 10% International Annealed Copper Standard (IACS), while the hardness dropped by only 40 HV. Further, it is shown that low temperature aging at 130 °C after SPD results in the following phenomena: the hardness of the alloy is restored almost to the initial level, with a slight decrease in conductivity, which still remained higher than in the original state. All microstructural parameters of the alloy including aluminum matrix composition, grain size, grain boundaries fraction, and morphology of the precipitates are characterized and correlated with the observed effect of SPD on the strength and electrical conductivity of alloy AA6061.

KW - aging

KW - aluminum alloy AA6061

KW - mechanical and electrical properties

KW - severe plastic deformation

UR - http://www.scopus.com/inward/record.url?scp=85064767096&partnerID=8YFLogxK

U2 - 10.1002/adem.201801370

DO - 10.1002/adem.201801370

M3 - مقالة

SN - 1438-1656

VL - 21

JO - Advanced Engineering Materials

JF - Advanced Engineering Materials

IS - 8

M1 - 1801370

ER -

Effect of SPD Processing on the Strength and Conductivity of AA6061 Alloy

Abstract

Keywords

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this