Abstract
During decomposition of copper formate, a volatile intermediate is formed, that can be utilized to fabricate conductive copper lines for electrical interconnections. By the method called Reactive Transfer Printing (RTP), a pattern of copper (II) formate was printed, and placed adjacent to a second surface; decomposition of the printed pattern led to a transfer of copper to the second substrate. It was found that the yield of the transfer process improved due to presence of several carboxylic acids which are liquid with a high boiling point. Furthermore we found that the transport of copper starts at a lower temperature than previously reported, indicating that the first decomposition step of copper formate is related to the catalytic decomposition of formic acid on a copper surface. The findings enable printing of conductive copper patterns onto the interior surface of a glass vessel.
| Original language | English |
|---|---|
| Pages (from-to) | 261-267 |
| Number of pages | 7 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 3 |
| Issue number | 5 |
| DOIs | |
| State | Published - 2018 |
Keywords
- Cu
- chemical vapor deposition (CVD) (chemical reaction)
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
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