Abstract
Conductive copper inks have attracted much attention as low-cost replacement for the currently used silver inks for printed electronics. The copper inks should be stable to oxidation at all stages of fabrication of conductive patterns: ink formulation and storage, printing, and post-printing treatment. In the present study, air-stable copper-silver core-shell (Cu@Ag) submicron particles were utilized in conductive ink formulations. To improve the conductivity of the resulting Cu@Ag coatings, the effect of various carboxylic acids was evaluated. It was found that all acids led to decreased resistivity after sintering at elevated temperatures, while the lowest value was only 4 times higher than the bulk resistivity at 3 wt% of oleic. The mechanism governing the effect of carboxylic acids is discussed, in view of possible stabilizer exchange and oxide dissolution.
| Original language | American English |
|---|---|
| Pages (from-to) | 320-327 |
| Number of pages | 8 |
| Journal | Colloids and Surfaces A: Physicochemical and Engineering Aspects |
| Volume | 522 |
| DOIs | |
| State | Published - 5 Jun 2017 |
Keywords
- Carboxylic acids
- Conductive properties
- Copper@silver core shell particles
- Ink formulation
- Thermal sintering
All Science Journal Classification (ASJC) codes
- Surfaces and Interfaces
- Physical and Theoretical Chemistry
- Colloid and Surface Chemistry