Abstract
We studied power dissipation in 1L MoS 2 devices using Raman thermometry for the first time. We uncovered non-uniformities of power dissipation and the important role of the MoS 2 -substrate interface thermal resistance. These results provide critical insights for thermal design of devices based on 2D materials. This work was supported by the AFOSR, NSF EFRI 2-DARE, and Stanford SystemX.
| Original language | English |
|---|---|
| Title of host publication | 2016 74th Annual Device Research Conference (DRC) |
| Pages | 1-2 |
| Number of pages | 2 |
| DOIs | |
| State | Published - 2016 |
| Externally published | Yes |