Abstract
We present the first steps of a device suitable for characterization of complex 3D micro-structures. This method is based on an optical approach allowing extraction and separation of high frequency ultrasonic sound waves induced to the analyzed samples. Rapid, non-destructive characterization of 3D micro-structures are limited in terms of geometrical features and optical properties of the sample. We suggest a method which is based on temporal tracking of secondary speckle patterns generated when illuminating a sample with a laser probe while applying known periodic vibration using an ultrasound transmitter. In this paper we investigated lasers drilled through glass vias. The large aspect ratios of the vias possess a challenge for traditional microscopy techniques in analyzing depth and taper profiles of the vias. The correlation of the amplitude vibrations to the vias depths is experimentally demonstrated.
Original language | English |
---|---|
Article number | 095402 |
Journal | Journal of Optics (United Kingdom) |
Volume | 18 |
Issue number | 9 |
DOIs | |
State | Published - Sep 2016 |
Keywords
- 3D characterization
- TGVs
- laser drilling
- laser micromachining
- speckles
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics