@inproceedings{b25741f618bd4239bfb21fac0561bcba,
title = "Contactless manipulation of silicon wafers using acoustic levitation",
abstract = "Described in this paper is a system capable of controlling the position of silicon wafers with no mechanical contact by means of an ultrasonically controlled layer of air. The system exploits several high-frequency annular actuators to produce standing and traveling waves that affect the air layer underneath the wafer. By controlling the pressure and the flow with ultrasonic vibrations, the wafer can be held at a fixed elevation or to be moved to a given a x,y position or a desired rotation angle, . The ultrasonic vibration amplitude affects, the vertical z-axis' elevation which can also be precisely controlled. The paper briefly describes the dynamics of the individual annular vibrating elements, the sensing systems and finally shown is a laboratory demonstrator with full control of an acoustically levitated silicon wafer.",
author = "I. Bucher and R. Gabai and R. Shaham and S. Davis",
note = "Publisher Copyright: {\textcopyright} Proceedings of ISMA 2018 - International Conference on Noise and Vibration Engineering and USD 2018 - International Conference on Uncertainty in Structural Dynamics. All rights reserved.; 28th International Conference on Noise and Vibration Engineering, ISMA 2018 and 7th International Conference on Uncertainty in Structural Dynamics, USD 2018 ; Conference date: 17-09-2018 Through 19-09-2018",
year = "2018",
language = "الإنجليزيّة",
series = "Proceedings of ISMA 2018 - International Conference on Noise and Vibration Engineering and USD 2018 - International Conference on Uncertainty in Structural Dynamics",
pages = "3389--3397",
editor = "D. Moens and W. Desmet and B. Pluymers and W. Rottiers",
booktitle = "Proceedings of ISMA 2018 - International Conference on Noise and Vibration Engineering and USD 2018 - International Conference on Uncertainty in Structural Dynamics",
}