Characterization and Prediction of QUIC's Performance Under Different Network Conditions

Lior Siag, Gil Einziger, Wuji Liu, Chase Wu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

QUIC is a UDP-based application-level transport protocol implementing TCP-like properties. QUIC is optimized toward web activities such as HTTP and HTTPS, and is gaining rapid popularity as most Google clients use this protocol to access Google's services. However, despite its popularity, we still lack an in-depth understanding of QUIC's performance in various network environments. While the existing work evaluates QUIC in multiple scenarios, we do not have sufficient knowledge to derive a predictive performance model for QUIC and remain mainly with a few anecdotes. Based on an exploratory analysis of the effects of various parameters on QUIC's behavior, our work characterizes QUIC's performance and develops a predictive model, providing insights into the main parameters affecting QUIC's performance, such as loss, packet reordering, and latency. The resulted predictive model opens the door for future optimization and protocol design.

Original languageAmerican English
Title of host publicationICC 2023 - IEEE International Conference on Communications
Subtitle of host publicationSustainable Communications for Renaissance
EditorsMichele Zorzi, Meixia Tao, Walid Saad
Pages3824-3829
Number of pages6
ISBN (Electronic)9781538674628
DOIs
StatePublished - 1 Jan 2023
Event2023 IEEE International Conference on Communications, ICC 2023 - Rome, Italy
Duration: 28 May 20231 Jun 2023

Publication series

NameIEEE International Conference on Communications
Volume2023-May

Conference

Conference2023 IEEE International Conference on Communications, ICC 2023
Country/TerritoryItaly
CityRome
Period28/05/231/06/23

Keywords

  • QUIC
  • performance prediction
  • transport-layer performance

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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