Bonding of Bi2Te3-Based Thermoelectric Legs to Metallic Contacts Using Bi0.82Sb0.18 Alloy

Roi Vizel, Tal Bargig, Ofer Beeri, Yaniv Gelbstein

Research output: Contribution to journalArticlepeer-review

Abstract

Thermoelectrics is gaining increased attention as a renewable direct energy conversion method from heat to electricity. The most efficient and up-to-date thermoelectric materials for temperatures of up to 250°C are (Bi1−xSbx)2(Te1−ySey)3 alloys. In the current research, to discover practical thermoelectric power generation devices capable of operation at such temperatures, Bi0.82Sb0.18 alloy was considered as a lead-free high-temperature (<250°C) solder composition for bonding of n-type Bi2Te2.4Se0.6 and p-type Bi0.4Sb1.6Te3 legs into Cu, Ag, Ni and Fe metallic bridges. In the case of Cu, fine contacts with low electrical contact resistance of ∼1.5 ± 0.5 mΩ mm2 were observed upon soldering at 350°C.

Original languageAmerican English
Pages (from-to)1296-1300
Number of pages5
JournalJournal of Electronic Materials
Volume45
Issue number3
DOIs
StatePublished - 1 Mar 2016

Keywords

  • Bi-Sb
  • BiTe
  • Thermoelectrics
  • bonding

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry
  • Electrical and Electronic Engineering

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