Antenna packaging of a 32 element TX/RX phased array RFIC for 60 GHz communications

Emanuel Cohen; Mark Ruberto; Moshik Cohen; Helen K. Pan; Shmuel Ravid

doi:https://doi.org/10.1109/COMCAS.2013.6685306

Antenna packaging of a 32 element TX/RX phased array RFIC for 60 GHz communications

Emanuel Cohen, Mark Ruberto, Moshik Cohen, Helen K. Pan, Shmuel Ravid

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

An integrated CMOS 60GHz phased array antenna module supporting symmetrical 32 elements TX/RX for wireless docking is described. The RFIC is packaged with a 6×6 patch antenna on LTCC creating a 25mm × 25mm LGA package having an antenna gain of 19dBi and ∼2dB routing loss. The TX total EIRP is 29dBm at -19dB EVM with scanning of +/-30deg. The RFIC is also packaged with two 2×16 slot loop antenna on high density PCB with 17dBi peak gain and steering of up to +/-50deg.

Original language	English
Title of host publication	2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013
DOIs	https://doi.org/10.1109/COMCAS.2013.6685306
State	Published - 2013
Externally published	Yes
Event	2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013 - Tel Aviv, Israel Duration: 21 Oct 2013 → 23 Oct 2013

Publication series

Name	2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013

Conference

Conference	2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013
Country/Territory	Israel
City	Tel Aviv
Period	21/10/13 → 23/10/13

Keywords

60GHz
Antenna in package
LTCC
Phased array
conformal package

All Science Journal Classification (ASJC) codes

Computer Networks and Communications
Electrical and Electronic Engineering

Access to Document

https://doi.org/10.1109/COMCAS.2013.6685306

Cite this

Cohen, E., Ruberto, M., Cohen, M., Pan, H. K., & Ravid, S. (2013). Antenna packaging of a 32 element TX/RX phased array RFIC for 60 GHz communications. In 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013 Article 6685306 (2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013). https://doi.org/10.1109/COMCAS.2013.6685306

Cohen, Emanuel ; Ruberto, Mark ; Cohen, Moshik et al. / Antenna packaging of a 32 element TX/RX phased array RFIC for 60 GHz communications. 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013. 2013. (2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013).

@inproceedings{0a6ba53d0f124e5b81c377061608d568,

title = "Antenna packaging of a 32 element TX/RX phased array RFIC for 60 GHz communications",

abstract = "An integrated CMOS 60GHz phased array antenna module supporting symmetrical 32 elements TX/RX for wireless docking is described. The RFIC is packaged with a 6×6 patch antenna on LTCC creating a 25mm × 25mm LGA package having an antenna gain of 19dBi and ∼2dB routing loss. The TX total EIRP is 29dBm at -19dB EVM with scanning of +/-30deg. The RFIC is also packaged with two 2×16 slot loop antenna on high density PCB with 17dBi peak gain and steering of up to +/-50deg.",

keywords = "60GHz, Antenna in package, LTCC, Phased array, conformal package",

author = "Emanuel Cohen and Mark Ruberto and Moshik Cohen and Pan, {Helen K.} and Shmuel Ravid",

year = "2013",

doi = "https://doi.org/10.1109/COMCAS.2013.6685306",

language = "الإنجليزيّة",

isbn = "9781467357562",

series = "2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013",

booktitle = "2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013",

note = "2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013 ; Conference date: 21-10-2013 Through 23-10-2013",

}

Cohen, E, Ruberto, M, Cohen, M, Pan, HK & Ravid, S 2013, Antenna packaging of a 32 element TX/RX phased array RFIC for 60 GHz communications. in 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013., 6685306, 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013, 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013, Tel Aviv, Israel, 21/10/13. https://doi.org/10.1109/COMCAS.2013.6685306

Antenna packaging of a 32 element TX/RX phased array RFIC for 60 GHz communications. / Cohen, Emanuel; Ruberto, Mark; Cohen, Moshik et al.
2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013. 2013. 6685306 (2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Antenna packaging of a 32 element TX/RX phased array RFIC for 60 GHz communications

AU - Cohen, Emanuel

AU - Ruberto, Mark

AU - Cohen, Moshik

AU - Pan, Helen K.

AU - Ravid, Shmuel

PY - 2013

Y1 - 2013

N2 - An integrated CMOS 60GHz phased array antenna module supporting symmetrical 32 elements TX/RX for wireless docking is described. The RFIC is packaged with a 6×6 patch antenna on LTCC creating a 25mm × 25mm LGA package having an antenna gain of 19dBi and ∼2dB routing loss. The TX total EIRP is 29dBm at -19dB EVM with scanning of +/-30deg. The RFIC is also packaged with two 2×16 slot loop antenna on high density PCB with 17dBi peak gain and steering of up to +/-50deg.

AB - An integrated CMOS 60GHz phased array antenna module supporting symmetrical 32 elements TX/RX for wireless docking is described. The RFIC is packaged with a 6×6 patch antenna on LTCC creating a 25mm × 25mm LGA package having an antenna gain of 19dBi and ∼2dB routing loss. The TX total EIRP is 29dBm at -19dB EVM with scanning of +/-30deg. The RFIC is also packaged with two 2×16 slot loop antenna on high density PCB with 17dBi peak gain and steering of up to +/-50deg.

KW - 60GHz

KW - Antenna in package

KW - LTCC

KW - Phased array

KW - conformal package

UR - http://www.scopus.com/inward/record.url?scp=84893319814&partnerID=8YFLogxK

U2 - https://doi.org/10.1109/COMCAS.2013.6685306

DO - https://doi.org/10.1109/COMCAS.2013.6685306

M3 - منشور من مؤتمر

SN - 9781467357562

T3 - 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013

BT - 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013

T2 - 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013

Y2 - 21 October 2013 through 23 October 2013

ER -

Cohen E, Ruberto M, Cohen M, Pan HK, Ravid S. Antenna packaging of a 32 element TX/RX phased array RFIC for 60 GHz communications. In 2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013. 2013. 6685306. (2013 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, COMCAS 2013). doi: https://doi.org/10.1109/COMCAS.2013.6685306

Antenna packaging of a 32 element TX/RX phased array RFIC for 60 GHz communications

Abstract

Publication series

Conference

Keywords

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this