TY - GEN
T1 - A simple constitutive model for dielectric charging based on Frenkel-Poole mechanism
AU - Rubin, Tal
AU - Papaioannou, George
AU - Elata, David
N1 - Publisher Copyright: © 2015 IEEE.
PY - 2015/5/6
Y1 - 2015/5/6
N2 - We present a new simple constitutive model for dielectric charging. The model is motivated by the functional form of the Frenkel-Poole conduction, but it enables to track the time evolution of charge distribution within the dielectric. The prediction of charge distribution is used to deduce the voltage buildup in the dielectric. Based on this model, we present a prediction of the current through a Metal-Insulator-Metal (MIM) structure when it is subjected to voltage loading, and present a prediction of the discharge process and its limitations. We propose a voltage-control measurement protocol for the MIM structure, to calibrate the two material parameters of the model.
AB - We present a new simple constitutive model for dielectric charging. The model is motivated by the functional form of the Frenkel-Poole conduction, but it enables to track the time evolution of charge distribution within the dielectric. The prediction of charge distribution is used to deduce the voltage buildup in the dielectric. Based on this model, we present a prediction of the current through a Metal-Insulator-Metal (MIM) structure when it is subjected to voltage loading, and present a prediction of the discharge process and its limitations. We propose a voltage-control measurement protocol for the MIM structure, to calibrate the two material parameters of the model.
UR - http://www.scopus.com/inward/record.url?scp=84944769210&partnerID=8YFLogxK
U2 - https://doi.org/10.1109/EuroSimE.2015.7103090
DO - https://doi.org/10.1109/EuroSimE.2015.7103090
M3 - منشور من مؤتمر
T3 - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
BT - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
T2 - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
Y2 - 19 April 2015 through 22 April 2015
ER -