A process for electroplating of copper

Yair Ein-Eli; Nina Sezin; David Starosvetsky

A process for electroplating of copper

Yair Ein-Eli (Inventor)
, Nina Sezin (Inventor)
, David Starosvetsky (Inventor)

Materials Science & Engineering

Technion - Israel Institute of Technology

Research output: Patent

Abstract

A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.

Original language	American English
Patent number	CN102395712
IPC	H01L 23/ 532 A I
Priority date	11/02/10
State	Published - 28 Mar 2012

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title = "A process for electroplating of copper",

abstract = "A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.",

author = "Yair Ein-Eli and Nina Sezin and David Starosvetsky",

year = "2012",

month = mar,

day = "28",

language = "American English",

type = "Patent",

note = "CN102395712; H01L 23/ 532 A I",

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T1 - A process for electroplating of copper

AU - Ein-Eli, Yair

AU - Sezin, Nina

AU - Starosvetsky, David

PY - 2012/3/28

Y1 - 2012/3/28

N2 - A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.

AB - A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.

M3 - Patent

M1 - CN102395712

ER -

A process for electroplating of copper

Abstract

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