A 1.3 Tb/s parallel optics VCSEL link

Kobi Hasharoni; Shuki Benjamin; Amir Geron; Stanislav Stepanov; Gideon Katz; Itai Epstein; Niv Margalit; David Chairman; Michael Mesh

doi:10.1117/12.2038073

A 1.3 Tb/s parallel optics VCSEL link

Kobi Hasharoni, Shuki Benjamin, Amir Geron, Stanislav Stepanov, Gideon Katz, Itai Epstein, Niv Margalit, David Chairman, Michael Mesh

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

A high bandwidth optical interconnect is designed based on parallel optical VCSEL links. Large matrices with 168 data channels are utilized exhibiting the highest reported full duplex aggregate bandwidth of 1.34Tb/s. Optical links of 300m are measured with BER < 10^-12 while the power efficiency is 10.2 pJ/bit. The interconnect design is that of hybrid device with the III-V optoelectronics assembled directly onto the ASIC using Au/Sn eutectic bonding. Optical packaging is enabled using fiber bundle matrices whose dimensions are identical to those of the optoelectronic chips. The entire chip is assembled onto a system PCB in telecom and datacom applications. The backplane of the system becomes passive optical backplane and is entirely fiber based. The hybrid integration allows for a 3-fold increase in the number of SerDes available on a single package to about 500 lanes.

Original language	English
Title of host publication	Optical Interconnects XIV
Publisher	SPIE
ISBN (Print)	9780819499042
DOIs	https://doi.org/10.1117/12.2038073
State	Published - 2014
Externally published	Yes
Event	Optical Interconnects XIV - San Francisco, CA, United States Duration: 3 Feb 2014 → 5 Feb 2014

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	8991

Conference

Conference	Optical Interconnects XIV
Country/Territory	United States
City	San Francisco, CA
Period	3/02/14 → 5/02/14

Keywords

III-V on CMOS
Optical interconnect
Optical package
Parallel optics
VCSEL

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

Access to Document

10.1117/12.2038073

Cite this

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title = "A 1.3 Tb/s parallel optics VCSEL link",

abstract = "A high bandwidth optical interconnect is designed based on parallel optical VCSEL links. Large matrices with 168 data channels are utilized exhibiting the highest reported full duplex aggregate bandwidth of 1.34Tb/s. Optical links of 300m are measured with BER < 10-12 while the power efficiency is 10.2 pJ/bit. The interconnect design is that of hybrid device with the III-V optoelectronics assembled directly onto the ASIC using Au/Sn eutectic bonding. Optical packaging is enabled using fiber bundle matrices whose dimensions are identical to those of the optoelectronic chips. The entire chip is assembled onto a system PCB in telecom and datacom applications. The backplane of the system becomes passive optical backplane and is entirely fiber based. The hybrid integration allows for a 3-fold increase in the number of SerDes available on a single package to about 500 lanes.",

keywords = "III-V on CMOS, Optical interconnect, Optical package, Parallel optics, VCSEL",

author = "Kobi Hasharoni and Shuki Benjamin and Amir Geron and Stanislav Stepanov and Gideon Katz and Itai Epstein and Niv Margalit and David Chairman and Michael Mesh",

year = "2014",

doi = "10.1117/12.2038073",

language = "الإنجليزيّة",

isbn = "9780819499042",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

publisher = "SPIE",

booktitle = "Optical Interconnects XIV",

address = "الولايات المتّحدة",

note = "Optical Interconnects XIV ; Conference date: 03-02-2014 Through 05-02-2014",

}

Hasharoni, K, Benjamin, S, Geron, A, Stepanov, S, Katz, G, Epstein, I, Margalit, N, Chairman, D & Mesh, M 2014, A 1.3 Tb/s parallel optics VCSEL link. in Optical Interconnects XIV., 89910C, Proceedings of SPIE - The International Society for Optical Engineering, vol. 8991, SPIE, Optical Interconnects XIV, San Francisco, CA, United States, 3/02/14. https://doi.org/10.1117/12.2038073

TY - GEN

T1 - A 1.3 Tb/s parallel optics VCSEL link

AU - Hasharoni, Kobi

AU - Benjamin, Shuki

AU - Geron, Amir

AU - Stepanov, Stanislav

AU - Katz, Gideon

AU - Epstein, Itai

AU - Margalit, Niv

AU - Chairman, David

AU - Mesh, Michael

PY - 2014

Y1 - 2014

N2 - A high bandwidth optical interconnect is designed based on parallel optical VCSEL links. Large matrices with 168 data channels are utilized exhibiting the highest reported full duplex aggregate bandwidth of 1.34Tb/s. Optical links of 300m are measured with BER < 10-12 while the power efficiency is 10.2 pJ/bit. The interconnect design is that of hybrid device with the III-V optoelectronics assembled directly onto the ASIC using Au/Sn eutectic bonding. Optical packaging is enabled using fiber bundle matrices whose dimensions are identical to those of the optoelectronic chips. The entire chip is assembled onto a system PCB in telecom and datacom applications. The backplane of the system becomes passive optical backplane and is entirely fiber based. The hybrid integration allows for a 3-fold increase in the number of SerDes available on a single package to about 500 lanes.

AB - A high bandwidth optical interconnect is designed based on parallel optical VCSEL links. Large matrices with 168 data channels are utilized exhibiting the highest reported full duplex aggregate bandwidth of 1.34Tb/s. Optical links of 300m are measured with BER < 10-12 while the power efficiency is 10.2 pJ/bit. The interconnect design is that of hybrid device with the III-V optoelectronics assembled directly onto the ASIC using Au/Sn eutectic bonding. Optical packaging is enabled using fiber bundle matrices whose dimensions are identical to those of the optoelectronic chips. The entire chip is assembled onto a system PCB in telecom and datacom applications. The backplane of the system becomes passive optical backplane and is entirely fiber based. The hybrid integration allows for a 3-fold increase in the number of SerDes available on a single package to about 500 lanes.

KW - III-V on CMOS

KW - Optical interconnect

KW - Optical package

KW - Parallel optics

KW - VCSEL

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U2 - 10.1117/12.2038073

DO - 10.1117/12.2038073

M3 - منشور من مؤتمر

SN - 9780819499042

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Optical Interconnects XIV

PB - SPIE

T2 - Optical Interconnects XIV

Y2 - 3 February 2014 through 5 February 2014

ER -

A 1.3 Tb/s parallel optics VCSEL link

Abstract

Publication series

Conference

Keywords

All Science Journal Classification (ASJC) codes

Access to Document

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