PROCESS FOR LOCALIZED REPAIR OF GRAPHENE-COATED LAMINATION STACKS AND PRINTED CIRCUIT BOARDS

Doron Naveh (مخترع), Eilam Zigi Ben Smolinsky (مخترع), Adi Levi (مخترع), Elad Mentovich (مخترع), Boaz Atias (مخترع)

نتاج البحث: براءة الإختراع

ملخص

Processes for localized lasering of a lamination stack and graphene-coated printed circuit board (PCB) are disclosed. An example PCB may include a lamination stack, post-lamination, that may further include a core, an adhesive layer, and at least one graphene-metal structure. A top layer of graphene of the graphene-metal structure may have never been grown before the lamination process or may have been removed post-lamination such that a portion of the top layer of graphene is missing. The localized lasering process described herein may grow (for the first time) or re-grow the graphene layer of the exposed portion of the metal layer without adverse effects to the rest of the lamination stack or PCB and while promoting a uniform layer of graphene on the top surface. A process of growing graphene through application of molecular layer and a self-assembled monolayer (SAM), are also described herein.

اللغة الأصليةإنجليزيّة أمريكيّة
رقم براءة الاختراعWO2022243894
تصنيف براءة الاختراع الدوليH01L 21/ 285 A I
تاريخ الأولوية١/٠٧/٢١
حالة النشرنُشِر - 24 نوفمبر 2022

بصمة

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